BGA/CSP Rework Station RMD-08

BGA/CSP Rework Station RMD-08

Shenzhen, China
Production capacity:
20 Set / Month
Shenzhen, China
Company
86-755-33669188
Ivan Zhu
Contact person

Basic Information

Features:Intelligent heating wire, the fan does not turn; the hot wire is not energized.The computer control, the intelligence high, the whole operation is simple and easy to learn.The first heating zone, the second heating zone heater uses finely gives off heat the material, produces the high temperature breeze, the third heating zone uses the far infrared to send the hot plate preheating, prevents the PCB board distortion.6 section of warm area controls.The handhold real suction pen attracts BGA, convenient, is reliable, and is durable.Has the special contour plate work clothes, is suitable each kind of different motherboard.Have many kinds of size hot blast spray nozzle, or according to requests to carry on the custom make specially.After the heating complete, the adoption fan carries on cooling to the PCB plank, keeping PCB plank from transform.The BGA has voice to hint function after dismantle unload, weld to complete.Abundant software function: Interface simple and direct amity, enactment, modification, the conservancy parameter, the parameter number limited.The temperature curve test, analyzes, print, and keep.Follow to heat process automatically; heat the process curve draw automatically.The temperature is whole to settle, the temperature deviation correct.

Delivery terms and packaging

Packaging Detail: Vacuum packing for sea transportation Delivery Detail: Lead time 25 days
Port: FOB Shenzhen

Payment term

Telegraphic transfer

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    Дата события:

    12.10.2016 - 18.10.2016
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